Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
| By: | Juan Cepeda-Rizo; Jeremiah Gayle; Joshua Ravich |
| Publisher: | Taylor & Francis |
| Print ISBN: | 9781032160856 |
| eText ISBN: | 9781000511086 |
| Edition: | 1 |
| Format: | Reflowable |
eBook Features
Instant Access
Purchase and read your book immediately
Read Offline
Access your eTextbook anytime and anywhere
Study Tools
Built-in study tools like highlights and more
Read Aloud
Listen and follow along as Bookshelf reads to you
Details
Table of Contents